What are the types? Abstract: What is the material of the circuit board? The circuit board, also known as the PCB board, is the provider of electrical connections for electronic components. The main advantage of circuit boards is that wiring and assembly errors are greatly reduced, and the level of automation and production labor is increased. The main material of the printed circuit board is copper clad laminate. The copper clad laminate is a plate-shaped material formed by immersing electronic glass fiber cloth or other reinforcing materials in resin, single-sided or double-sided copper-clad foil, and hot pressing. What are the common types of CCL? Let’s take a look with me next.

What is the material of the circuit board
The main material of printed circuit board is copper clad laminate, and copper clad laminate (copper clad laminate) consists of substrate, copper foil and adhesive. The base material is an insulating layer composed of polymer synthetic resin and reinforcing material; the surface of the base material is covered with a layer of pure copper foil with high conductivity and good solderability, usually with a thickness of 35-50/ma; the copper foil is covered on the base material The single-sided copper clad laminate on the top is called single-sided copper clad laminate, and the copper clad laminate with copper foil on both sides of the substrate is called double-sided copper clad laminate. Whether the copper foil can be firmly covered on the substrate is completed by the adhesive. Commonly used CCL thicknesses are 1.0mm, 1.5mm and 2.0mm.

CCL
1 What are the types. According to the mechanical stiffness of CCL, it can be divided into: rigid CCL and flexible CCL.
2. According to different insulating materials and structures, it can be divided into: organic resin-based CCL, metal-based CCL, and ceramic-based CCL.
3. According to the thickness of CCL, it can be divided into: thick plate (thickness range is 0.8-3.2mm (including Cu)) and thin plate (thickness range is less than 0.78mm (excluding Cu)).
4. According to the reinforcing material of CCL, it is divided into: glass cloth base CCL, paper base CCL, composite base CCL (CME-1, CME-2).
5. According to the flame retardant grade, it is divided into: flame retardant board and non-flame retardant board.
6. According to UL standards (UL94, UL746E, etc.) to classify the flame retardant grades of copper clad laminates, rigid copper clad laminates can be divided into four different flame retardant grades: UL-94V0; UL-94V1; UL-94V2 and UL-94HB grades.

1 Common types and characteristics. Copper Clad Phenolic Paper Laminate
It is a laminate made of insulating impregnated paper (TFz-62) or cotton fiber impregnated paper (1TZ–63) impregnated with phenolic resin and hot pressed. One side is covered with copper foil. Mainly used as a pcb in radio equipment.

2. Copper Clad Phenolic Glass Cloth Laminate
It is a laminate made of alkali-free glass cloth impregnated with epoxy phenolic resin and hot pressed. Single-sided or double-sided copper clad foil has the advantages of light weight, good electrical and mechanical properties, and convenient processing. The board is pale yellow. If melamine is used as the curing agent, the surface of the board is light green and the transparency is good. Mainly used as a pcb in radio equipment with high operating temperature and operating frequency.

3. Copper Clad PTFE Laminate
It is a copper-clad laminate made of polytetrafluoroethylene sheet as the base material, copper-clad foil, and hot-pressed. Mainly used for high frequency and ultra high frequency circuits as printed boards.

4. Copper Clad Epoxy Glass Cloth Laminate: A common material for hole metallized printed boards.

5. Soft polyester copper-clad film: It is a strip material made of polyester film and copper hot-pressed. It is rolled into a spiral and placed inside the device during application. For reinforcement or moisture resistance, it is usually cast in one piece with epoxy resin. Mainly used for flexible printed circuits and printed cables, and can be used as a transition line for connectors. At present, the copper clad laminates on the market are mainly divided into the following categories from the substrate: paper substrate, glass fiber cloth substrate, synthetic fiber cloth substrate, non-woven fabric substrate, and composite substrate.

6. Common materials for CCL

FR-1 – phenolic tissue paper, this substrate is generally called bakelite (more economical than FR-2)

FR-2──Phenolic paper

FR-3──Tissue Paper, Epoxy Resin

FR-4──glass cloth, epoxy resin

FR-5──glass cloth, epoxy resin

FR-6──Frosted Glass, Polyester

G-10──glass cloth, epoxy resin

CEM-1──Toilet Paper, Epoxy Resin (Flame Retardant)

CEM-2──Toilet Paper, Epoxy Resin (Not Flame Retardant)

CEM-3──glass cloth, epoxy resin

CEM-4──glass cloth, epoxy resin

CEM-5──glass cloth, polyester

AIN – Aluminum Nitride

SIC – Silicon Carbide

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